Company Profile

YIELD ENGINEERING SYSTEMS KOREA, INC.

Semiconductor solutions in Cleaning; Washing Equipment for Assembly & Packaging and Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners.

Cleaning; Washing Equipment for Assembly & Packaging 및 Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners 분야의 반도체 솔루션을 제공합니다.

Equipment

Verified Quality B

Korea (South)

Hwaseong-si

Trust Snapshot

Verification

Verified

Last verified: 2026-02-14

Quality Grade

Grade B

Sources: 2

Location

Korea (South)

Hwaseong-si

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Overview

Primary stage: Equipment
Stages: Equipment, Packaging / OSAT
Country: Korea (South)
City: Hwaseong-si

What They Do

Cleaning; Washing Equipment for Assembly & Packaging
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Solder Reflow; Soldering & Brazing Equipment
Wafer Level Bonders
Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
Bumping Systems

Products / Tech

VertaCure LX

Sources

2 sources · expo.semi.org, expo.semi.org

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Companies with overlapping stages or tags.

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