Company Profile

WOOWON TECHNOLOGY CO., LTD.

Semiconductor solutions in Die Bonding; Attach Equipment and Package Handling; Conveying Equipment.

Die Bonding; Attach Equipment 및 Package Handling; Conveying Equipment 분야의 반도체 솔루션을 제공합니다.

Equipment
Verified Quality B
Korea (South)
Seongnam-si, Gyeonggi-do

Trust Snapshot

Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Location
Korea (South)
Seongnam-si, Gyeonggi-do
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Overview

  • Primary stage: Equipment
  • Stages: Equipment, Test / Inspection
  • Country: Korea (South)
  • City: Seongnam-si, Gyeonggi-do

What They Do

  • Die Bonding; Attach Equipment
  • Package Handling; Conveying Equipment
  • Wire Bonding Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Vibration Isolation Systems
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection

Tags

Links

Sources

2 sources · expo.semi.org, expo.semi.org

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