Company Profile

Toppan

Packaging and substrate solutions for electronics and semiconductors.

전자/반도체용 패키징 및 기판 솔루션을 제공합니다.

Packaging / OSAT

Japan

Tokyo

Overview

Primary stage: Packaging / OSAT
Stages: Packaging / OSAT
Region: Asia
Country: Japan
City: Tokyo

What They Do

Packaging materials
Substrates

Products / Tech

FC-BGA substrates
Packaging materials

Links

Website: https://www.toppan.com/

Tags

packagingsubstrate

Sources

https://www.toppan.com/

Last Verified

2026-02-12