Company Profile
Toppan
Packaging and substrate solutions for electronics and semiconductors.
전자/반도체용 패키징 및 기판 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-12
Quality Grade
Grade B
Sources: 1
Overview
- Primary stage: Packaging / OSAT
- Stages: Packaging / OSAT
- Region: Asia
- Country: Japan
- City: Tokyo
What They Do
- Packaging materials
- Substrates
Products / Tech
- FC-BGA substrates
- Packaging materials
Tags
Links
- Website: https://www.toppan.com/
Sources
1 sources · toppan.com
Partner Ecosystem
Companies with overlapping stages or tags.
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