Company Profile
TOKYO OHKA KOGYO CO., LTD.
Since its establishment in 1940, Tokyo Ohka Kogyo Co., Ltd. has consistently pursued programs of research and development of superior new technologies and new technical methodologies based on the foll…
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners 및 Coat; Develop; Resist Processing; Track Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Equipment
- Stages: Equipment, Materials
- Country: Japan
- City: Kawasaki
What They Do
- Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
- Coat; Develop; Resist Processing; Track Equipment
- Spin on Glass (SOG); on Dielectric (SOD) Track systems
- Cleaning Chemicals; Solvents; Strippers
- Dopants; liquid or solid
- Other Specialty Chemicals
Tags
Links
- Website: http://www.tok.co.jp/en/index.html
Sources
2 sources · expo.semi.org, expo.semi.org
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