SHIBAURA MECHATRONICS CORPORATION

Trust Snapshot

Overview

• Primary stage: Equipment
• Stages: Equipment, Packaging / OSAT
• Country: Japan
• City: Sakae-ku, Yokohama

What They Do

• Die Bonding; Attach Equipment
• Die Sorter; Pick & Place; Flip Chip Placement Systems
• Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
• Wafer Level Bonders
• Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
• Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment

Tags

Links

• Website: https://www.shibaura.co.jp

Sources

2 sources · expo.semi.org, expo.semi.org

• https://expo.semi.org/korea2026/Public/exhibitors.aspx?ID=31093&sortMenu=102001
• https://expo.semi.org/korea2026/Public/eBooth.aspx?IndexInList=425&FromPage=Exhibitors.aspx&ParentBoothID=&ListByBooth=true&BoothID=656671

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