Company Profile
SEMES CO., LTD.
Semiconductor solutions in Dicing; Sawing; Scribing; Separation Equipment and Die Bonding; Attach Equipment.
Dicing; Sawing; Scribing; Separation Equipment 및 Die Bonding; Attach Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Equipment
- Stages: Equipment, Materials
- Country: Korea (South)
- City: Chungcheongnam-do
What They Do
- Dicing; Sawing; Scribing; Separation Equipment
- Die Bonding; Attach Equipment
- Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
- Coat; Develop; Resist Processing; Track Equipment
- Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
- Etching; Stripping; Ashing - Dry and Wet Equipment
Tags
Links
- Website: http://www.semes.com
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
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