Company Profile

SEMES CO., LTD.

Semiconductor solutions in Dicing; Sawing; Scribing; Separation Equipment and Die Bonding; Attach Equipment.

Dicing; Sawing; Scribing; Separation Equipment 및 Die Bonding; Attach Equipment 분야의 반도체 솔루션을 제공합니다.

Equipment
Verified Quality B
Korea (South)
Chungcheongnam-do

Trust Snapshot

Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Location
Korea (South)
Chungcheongnam-do
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Overview

  • Primary stage: Equipment
  • Stages: Equipment, Materials
  • Country: Korea (South)
  • City: Chungcheongnam-do

What They Do

  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Etching; Stripping; Ashing - Dry and Wet Equipment

Tags

Links

Sources

2 sources · expo.semi.org, expo.semi.org

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Companies with overlapping stages or tags.

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