Company Profile

RPS CO., LTD.

Semiconductor solutions in Backgrind; Slicing; Lapping; Polishing Equipment and Dicing; Sawing; Scribing; Separation Equipment.

Backgrind; Slicing; Lapping; Polishing Equipment 및 Dicing; Sawing; Scribing; Separation Equipment 분야의 반도체 솔루션을 제공합니다.

Equipment
Verified Quality B
Korea (South)
Daejeon

Trust Snapshot

Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Location
Korea (South)
Daejeon
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Overview

  • Primary stage: Equipment
  • Stages: Equipment, Materials
  • Country: Korea (South)
  • City: Daejeon

What They Do

  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Pneumatic Systems; Pneumatic rotary spindles
  • FPD Glass Substrate Processing Equipment, Materials and Parts

Tags

semicon-korea-2026 equipment materials

Links

Sources

2 sources · expo.semi.org, expo.semi.org

Partner Ecosystem

Companies with overlapping stages or tags.

ABSFIL
Equipment
Korea (South)
AFT Instrument
Equipment
Korea (South)
AST ENGINEERING, INC.
Equipment
Korea (South)
AVACO
Equipment
Korea (South)
BRONKHORST KOREA
Equipment
Korea (South)
CINOS CO., LTD
Equipment
Korea (South)

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