Company Profile
PAMTEK
Semiconductor solutions in Dicing; Sawing; Scribing; Separation Equipment and Die Bonding; Attach Equipment.
Dicing; Sawing; Scribing; Separation Equipment 및 Die Bonding; Attach Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Equipment
- Stages: Equipment, Materials
- Country: Korea (South)
- City: Hwaseong-si
What They Do
- Dicing; Sawing; Scribing; Separation Equipment
- Die Bonding; Attach Equipment
- Die Removal Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Marking; Imprinting; Labeling Equipment
- Wafer Level Bonders
Tags
Links
- Website: http://www.pamtek.com
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
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