Company Profile
HEIDELBERG INSTRUMENTS KOREA
Semiconductor solutions in Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners and Double sided mask aligner.
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners 및 Double sided mask aligner 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Equipment
- Stages: Equipment, Packaging / OSAT
- Country: Germany
- City: Heidelberg
What They Do
- Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
- Double sided mask aligner
- Equipment, Nanotechnology Tools
- Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
- Lithography; Patterning service
Products / Tech
- VPG+ 1400 FPD/VPG + 1850 VOLUME PATTERN GENERATORS
- VPG 300 DI | MASKLESS STEPPER
- MLA 300 | MASKLESS ALIGNER FOR VOLUME PRODUCTION
- ULTRA | SEMICONDUCTOR LASER MASK WRITER
- MLA 150 | ADVANCED MASKLESS ALIGNER
- DWL 66+ | THE ULTIMATE LITHOGRAPHY RESEARCH TOOL
Tags
Links
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
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