Company Profile

HANMI SEMICONDUCTOR

Semiconductor solutions in Dicing; Sawing; Scribing; Separation Equipment and Die Bonding; Attach Equipment.

Dicing; Sawing; Scribing; Separation Equipment 및 Die Bonding; Attach Equipment 분야의 반도체 솔루션을 제공합니다.

Equipment
Verified Quality B
Korea (South)
Incheon

Trust Snapshot

Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Location
Korea (South)
Incheon
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Overview

  • Primary stage: Equipment
  • Stages: Equipment, Materials
  • Country: Korea (South)
  • City: Incheon

What They Do

  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Marking; Imprinting; Labeling Equipment
  • Package Handling; Conveying Equipment
  • Wafer Level Bonders

Tags

semicon-korea-2026 equipment materials

Links

Sources

2 sources · expo.semi.org, expo.semi.org

Partner Ecosystem

Companies with overlapping stages or tags.

ABSFIL
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Korea (South)
AFT Instrument
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AST ENGINEERING, INC.
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Korea (South)
AVACO
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Korea (South)
BRONKHORST KOREA
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Korea (South)
CINOS CO., LTD
Equipment
Korea (South)

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