Company Profile
GANA CO.,LTD.
Semiconductor solutions in Ball Placement; Attach Systems and Die Bonding; Attach Equipment.
Ball Placement; Attach Systems 및 Die Bonding; Attach Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Equipment
- Stages: Equipment, Packaging / OSAT
- Country: Korea (South)
- City: Anyang-si, Gyeonggi-do
What They Do
- Ball Placement; Attach Systems
- Die Bonding; Attach Equipment
- Die Removal Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Products / Tech
- 차량용 카메라 및 LIDAR 용 접착제 휴대폰 카메라 용 접착제
- Finetech_high presision die bonder/flipchip bonder
- Hummink_NAZCA, Nano pattern direct printing soluti
- UNITEMP_Vacuum reflow oven/RTP
Tags
Links
- Website: http://www.ganatr.co.kr
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
Request Intro
Use a ready-made draft to introduce your company and request a collaboration call.