Company Profile
EHWA DIAMOND IND. CO., LTD.
Semiconductor solutions in Backgrind; Slicing; Lapping; Polishing Equipment and Dicing; Sawing; Scribing; Separation Equipment.
Backgrind; Slicing; Lapping; Polishing Equipment 및 Dicing; Sawing; Scribing; Separation Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Equipment
- Stages: Equipment, Materials
- Country: Korea (South)
- City: Osan City
What They Do
- Backgrind; Slicing; Lapping; Polishing Equipment
- Dicing; Sawing; Scribing; Separation Equipment
- Cutting; Drilling; Laser ablation; Beveling Equipment
- Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
- Scribe Tools; Saw or Dicing Blades and Accessories
- CMP; Grind; Lap; Polish; Abrasive materials
Tags
Links
- Website: http://www.ehwadia.co.kr
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
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