Company Profile
DAESUNG ENGINEERING
Semiconductor solutions in Backgrind; Slicing; Lapping; Polishing Equipment and Wafer Mount; Taping Equipment.
Backgrind; Slicing; Lapping; Polishing Equipment 및 Wafer Mount; Taping Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Materials
- Stages: Materials, Equipment
- Country: Korea (South)
- City: Hwaseong
What They Do
- Backgrind; Slicing; Lapping; Polishing Equipment
- Wafer Mount; Taping Equipment
- Lamination; Sheet Laminating Equipment
- Vision; ID; Bar Code Systems
- Package Substrates; Laminate; Film based
- Test Sockets; Contactors and Contact accessories
Tags
Links
- Website: https://semids.com/
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
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