Company Profile
BESI (BE SEMICONDUCTOR INDUSTRIES N.V.)
Semiconductor solutions in Cut & Down Set; Trim; Form Equipment and Die Bonding; Attach Equipment.
Cut & Down Set; Trim; Form Equipment 및 Die Bonding; Attach Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Materials
- Stages: Materials, Equipment
- Country: Netherlands
- City: Duiven
What They Do
- Cut & Down Set; Trim; Form Equipment
- Die Bonding; Attach Equipment
- Die Removal Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Molding; Encapsulation; Decapsulation Equipment
- Plating; Electro Chemical Plating for device assembly
Tags
Links
- Website: http://www.besi.com
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
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