Company Profile
ASMPT
Semiconductor solutions in Ball Placement; Attach Systems and Cut & Down Set; Trim; Form Equipment.
Ball Placement; Attach Systems 및 Cut & Down Set; Trim; Form Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Equipment
- Stages: Equipment, Packaging / OSAT
- Country: Singapore
- City: Singapore
What They Do
- Ball Placement; Attach Systems
- Cut & Down Set; Trim; Form Equipment
- Dicing; Sawing; Scribing; Separation Equipment
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Tags
Links
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
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