Company Profile
AP SYSTEMS CORPORATION
Semiconductor solutions in Cleaning; Washing Equipment for Assembly & Packaging and Dicing; Sawing; Scribing; Separation Equipment.
Cleaning; Washing Equipment for Assembly & Packaging 및 Dicing; Sawing; Scribing; Separation Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Equipment
- Stages: Equipment, Packaging / OSAT
- Country: Korea (South)
- City: Hwaseong-si, Gyeonggi-do
What They Do
- Cleaning; Washing Equipment for Assembly & Packaging
- Dicing; Sawing; Scribing; Separation Equipment
- Dispensing Systems
- Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
- Wafer Level Bonders
- Laser Treatment; Cutting Systems for Panels & Photocells
Tags
Links
- Website: http://www.apsystems.co.kr
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
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