Company Profile
ACCRETECH KOREA CO., LTD.
Semiconductor solutions in Dicing; Sawing; Scribing; Separation Equipment and Die Sorter; Pick & Place; Flip Chip Placement Systems.
Dicing; Sawing; Scribing; Separation Equipment 및 Die Sorter; Pick & Place; Flip Chip Placement Systems 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Materials
- Stages: Materials, Equipment
- Country: Japan
- City: Hachioji-shi
What They Do
- Dicing; Sawing; Scribing; Separation Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Scribe and Break Equipment
- Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
- CMP; Grind; Lap; Polish; Abrasive materials
Tags
Links
- Website: https://www.accretech.jp
Sources
2 sources · expo.semi.org, expo.semi.org
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Companies with overlapping stages or tags.
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