Company Profile
3H CORPORATION LTD.
Semiconductor solutions in Ball Placement; Attach Systems and Dicing; Sawing; Scribing; Separation Equipment.
Ball Placement; Attach Systems 및 Dicing; Sawing; Scribing; Separation Equipment 분야의 반도체 솔루션을 제공합니다.
Trust Snapshot
Verification
Verified
Last verified: 2026-02-14
Quality Grade
Grade B
Sources: 2
Overview
- Primary stage: Equipment
- Stages: Equipment, Packaging / OSAT
- Country: Korea (South)
- City: Seongnam-si
What They Do
- Ball Placement; Attach Systems
- Dicing; Sawing; Scribing; Separation Equipment
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Solder Reflow; Soldering & Brazing Equipment
Tags
Links
- Website: https://3hcorp.co.kr/
Sources
2 sources · expo.semi.org, expo.semi.org
Partner Ecosystem
Companies with overlapping stages or tags.
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