Company Profile

3D-Micromac AG

Semiconductor solutions in Dicing; Sawing; Scribing; Separation Equipment and Marking; Imprinting; Labeling Equipment.

Dicing; Sawing; Scribing; Separation Equipment 및 Marking; Imprinting; Labeling Equipment 분야의 반도체 솔루션을 제공합니다.

Equipment

Verified Quality B

Germany

Chemnitz

Trust Snapshot

Verification

Verified

Last verified: 2026-02-14

Quality Grade

Grade B

Sources: 2

Location

Germany

Chemnitz

Dicing; Sawing; Scribing; Separation Equipment
Marking; Imprinting; Labeling Equipment
Scribe and Break Equipment
Cutting; Drilling; Laser ablation; Beveling Equipment
Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
Repair; Rework Equipment

2 sources · expo.semi.org, expo.semi.org

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